(408) 522-1500
Capabilities Our Services include PCB Fabrication and PCB Assembly ( if needed ).
Capabilities Our Capabilities include Rigid PCBs, Flex PCBs and Rigid-Flex PCBs
Capabilities You might also want to checkout our PCB Assembly Capability ( Click Here )
PCB Manufacturing Capabilities Print
Product Features
Standard Capability
Advanced Capability
Board Attributes Board Attributes
Min Layer count
1
1
Max Layer Count
24
26+
Min Board Thickness
.010"
004"
Max Board Thickness
.200"
.200" +
Min Core Thickness
.002"
.002"
Min Dielectric
.002"
.0015"
Min. Starting Copper Foil Weight
9 micron
< 5 micron
Max. Finished Copper Thickness (O/L)
6 oz
> 6 oz
Max. Finished Copper Thickness (I/L)
4 oz
> 4 oz
Maximum Panel Size
21" x 29"
21" x 29"
Minimum Panel Size
12" x 18"
12" x 18"
Smallest Mech Drill Diameter
.0059"
.004"
Smallest Laser Drill Diameter
.006"
.004"
Min Finished Hole Size
.004"
.002"
Max Thru Hole Aspect Ratio
16:01
> 16:1
Max Blind Via Aspect Ratio
.75:1
1.2:1
Blind Via Finished Hole Size
.004"
Plated shut
Buried Via Finished Hole Size
.004"
.002"
Min LW/LS (mils)
.003"
.002"
Min Pad Size for test
.005"
.003"
Process Pad Diameter
D + .012" (1 mil annular ring)
D + .010" (Tangency)
Controlled Impedance Tolerance
10%
5%
Solder Mask Registration
.002"
<.002"
Solder Mask Feature Tolerance
.001"
.001"
Solder Mask Min Dam Size
.004"
.002"
Min. Diameter Rout Cutter Available
.024"
.021"
Routed Part Size Tolerance
.010"
<.010"
Bow & Twist Tolerance
7%
< 7%
Thickness Tolerance
10%
< 10%
Sequential Lam
Yes
Yes
Buried Vias
Yes
Yes
Blind Vias
Yes
Yes
Conductive Filled Vias
Yes
Yes
Non Conductive Filled Vias
Yes
Yes
Surface Finishes Surface Finishes
HASL (Hot Air Solder Level)
Yes
Yes
Lead Free HASL
Yes
Yes
OSP (Shikoku F2)
Yes
Yes
OSP (Entek)
Yes
Yes
ENIG (Electroless Nickel Immersion Gold)
Yes
Yes
ENEPIG (Electroless Nickel Electroless Paladium Immersion Gold)
Yes
Yes
Immersion Silver
Yes
Yes
Immersion White Tin
Yes
Yes
Tin Nickel
Yes
Yes
Electrolytic Soft Gold
Yes
Yes
Electrolytic Hard Gold
Yes
Yes
Selective Gold
Yes
Yes
Solder Masks Solder Masks
Semi - Gloss Green
Yes
Yes
Gloss Green
Yes
Yes
Matte - Green
Yes
Yes
Black
Yes
Yes
Red
Yes
Yes
Blue
Yes
Yes
Yellow
Yes
Yes
Legend Legend
All colors
Yes
Yes
Fab Fab
Routed Array
Yes
Yes
V Score
Yes
Yes
Countersink
Yes
Yes
Counterbore
Yes
Yes
Bevel
Yes
Yes
Milling
Yes
Yes
Edge Castellation
Yes
Yes
Edge Plating
Yes
Yes
Heatsinks
Yes
Yes
Electrical Test Electrical Test
10 Volt
Yes
Yes
40 Volt (Burn in bds)
Yes
Yes
250 Volt
No
Yes
500 Volt
No
Yes
Hi Pot
No
Yes
Laminate Materials Laminate Materials
Very Thin Film
No
Yes
Arlon 85NT
Yes
Yes
Hybrid Constructions
Yes
Yes
Isola FR406
Yes
Yes
Isola FR408
Yes
Yes
Isola IS410
Yes
Yes
Isola IS620
No
Yes
Isola P95
Yes
Yes
Isola P96
Yes
Yes
Matsushita R1766
Yes
Yes
Matsushita R1755
Yes
Yes
Matsushita Megtron
Yes
Yes
Nelco N4000-13 (SI)
Yes
Yes
Nelco N4000-6 FC
Yes
Yes
Nelco N4000-29
Yes
Yes
Neltec N7000-2
Yes
Yes
No Flow Pre Preg
Yes
Yes
Polyclad PCL370HR
Yes
Yes
Polyclad Getek
Yes
Yes
PSA Bond Film
No
Yes
Rogers 3000
Yes
Yes
Rogers R4003
Yes
Yes
Rogers R4350
Yes
Yes
Rogers 5880
Yes
Yes
Rogers 6000
Yes
Yes
Rogers TMM
Yes
Yes
Available Reports Available Reports
Microsection
Yes
Yes
Solderability
Yes
Yes
X-ray Fluorescence
Yes
Yes
Ionic Contamination
Yes
Yes
Time Domain Reflectometry test (TDR)
Yes
Yes
FAI
Yes
Yes
Certificate of Compliance (C of C)
Yes
Yes
UL UL
94VO
Yes
Yes
PCB Classifications PCB Classifications
Military 55110
Yes
Yes
IPC 6012, Class 1, 2 & 3
Yes
Yes
ISO 9001:2000
Yes
Yes
Capabilities By Market
Capabilities By Process
High Reliability Boards
-Up to 2000 Thermal cycles
-For Boards that must not fail
Burn-in Boards
-14 Layers - .062" thick
-.5 mm pitch
-Step-down connectors
-Special materials
-Large sizes up to 24" x 28"
-High Reliability
High Technology Boards
-Differential Impedance
-Up to 30 Layers
-Lead Free process
-Special materials
-Sequential lamination
-Blind and buried vias
-Laser Drill
-Filled vias
-Via in pads
-Milspec
-Metal core
-Carbon paste
-Plated edges
-Plated edge holes
-Milling
-Heavy Copper
-Selective Finishes
Standard Technology Boards
-1 to 10 Layers
-Trace/Space 5/5
-Same day for 2 Layer PCBs
-24 hours to 10 Days for multilayers
-Lead Free process
-All standard materials
Front-end CAM
-Fully automated Tooling System
Imaging-Laser Direct Imaging
-Trace/Space 2/2
Multilayer Lamination
-Up to 30 Layers
-Sequential lamination
-Automated registration
Drilling
-.006" Mechanical Drill
-Laser Drill down to 2 mils (.002")
Etching
-Trace/Space 2/2 mils
Plating
-Aspect ratio 10+
Soldermask
-LPI, Dry Film
Silkscreen
-Automated
-5 mil lines
Fabrication
-Route and retain
-Scoring
Electrical Test
-.5mm pitch, Flying probe and High Density grid
Quality and Production Control Information System
-Pro-CIM
Materials
-Lead Free FR-4
-Polyimides
-Rogers 4003 & 4350
-Teflons
-Ceramics
-Most other materials
TOP