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Capabilities Our Services include PCB Fabrication and PCB Assembly ( if needed ).
Capabilities Our Capabilities include Rigid PCBs, Flex PCBs and Rigid-Flex PCBs
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PCB Manufacturing Capabilities Print
Product Features Standard Capability Advanced Capability Micro Electronics

PC Board Attributes
Min Layer count111
Max Layer Count30 30 30
Min Board Thickness.010".004".004"
Max Board Thickness0.250"0.250"0.250"
Min Core Thickness.002".002".002"
Min Dielectric.002".002".002"
Min. Starting Copper Foil Weight9 micron3 micron3 micron
Max. Finished Copper Thickness (O/L)6 oz> 6 oz.0015"
Max. Finished Copper Thickness (I/L)4 oz> 4 oz.001"
Maximum Panel Size21" x 29"21" x 29"12" x 18"
Minimum Panel Size12" x 18"12" x 18"8" x 8"
Smallest Mech Drill Diameter.0059".004".004"
Smallest Laser Drill Diameter.0040" / .0080".0025" / .0100".0025" / .0100"
Min Finished Hole Size.004".002"Plated shut
Max Thru Hole Aspect Ratio10:116:116:1
Max Blind Via Aspect Ratio.75:11.2:1.8:1
Blind Via Finished Hole Size.004"Plated shutPlated shut
Buried Via Finished Hole Size.004".002".002"
Minimum Line Width (trace) and Spacing.003".002".00125"
Min Pad Size for test.005".003".003"
Process Pad DiameterD + .012" (1 mil annular ring)D + .010" (Tangency)D + .006"
Stacked viasYesYesYes
Minimum Wire Bond Pad size> .006".004"0.0025"
Controlled Impedance Tolerance10%5%5%
Solder Mask Registration.002"<.002".002"
Solder Mask Feature Tolerance.001".001".001"
Solder Mask Min Dam Size.004".004".004"
Min. Diameter Rout Cutter Available.024".021".021"
Routed Part Size Tolerance.010"<.010"<.010"
Laser hole location Tolerance.0005".0005".0005"
Laser Routed Part Size Tolerance -
can only be done with panels <.032" thick		.001".001".001"
Bow & Twist TolerancePer IPC SpecPer IPC SpecPer IPC Spec
Thickness Tolerance10%< 10%< 10%
 
Sequential Lam3 or less lam cycles> 3 lam cycles> 3 lam cycles
Buried Vias2 or less> 3> 3
Blind ViasYesYesYes
Conductive Filled ViasYesYesYes - Cu plate shut
Non Conductive Filled ViasYesYesYes

Surface Finishes
HASL (Vertical or Horizontal)YesYesNo
OSP (Shikoku F2)YesYesYes
OSP (Entek)YesYesYes
ENIG (Electroless Nickel/Immersion Gold)YesYesYes
Immersion SilverYesYesYes
Tin NickelYesYesNo
Electrolytic Soft GoldYesYesYes
Electrolytic Hard GoldYesYesYes
Selective GoldYesYesYes

Solder Masks Finish
Semi - GlossyYesYesYes
GlossyYesYesYes
MatteYesYesYes

Solder Mask Colors
GreenYesYesYes
BlackYesYesYes
RedYesYesYes
BlueYesYesYes
YellowYesYesYes
WhiteYesYesYes
ClearYesYesYes
Bright WhiteYesYesYes
PurpleYesYesYes

Legend
All colorsYesYesYes

Fab
Routed ArrayYesYesYes
V Score, Edge to Copper0.01"0.007"0.007"
V Score Angles35°,45°,60°35°,45°,60°35°,45°,60°
CountersinkYesYesYes
CounterboreYesYesYes
BevelYesYesYes
Milling+/- .003"+/- .003"+/- .001"
Edge CastellationYesYesYes
Edge PlatingYesYesYes
HeatsinksYesYesNo

Electrical Test
10 VoltYesYesYes
40 Volt (Burn in bds)YesYesYes
250 VoltNoYesYes
500 VoltNoYesYes
Hi PotNoYesNo

Laminate Materials
Very Thin FilmNoYesYes
Arlon 85NTYesYesNo
BergquistYesYesNo
Hybrid ConstructionsYesYesYes
Isola FR406YesYesYes
Isola FR408YesYesYes
Isola IS410YesYesYes
Isola IS620NoYesNo
Isola P95YesYesYes
Isola P96YesYesYes
Iteq IT180YesYesYes
Panasonic R1766YesYesYes
Panasonic R1755YesYesNo
Panasonic MegtronYesYesNo
Nelco N4000-13YesYesYes
Nelco N4000-6 FCYesYesYes
Nelco N4000-29YesYesNo
Nelco BT N5000YesYesYes
Nelco N7000-2YesYesYes
No Flow Pre PregYesYesYes
Isola 370HRYesYesYes
Polyclad GetekYesYesYes
PSA Bond FilmNoYesYes
Rogers 3000 SeriesYesYesNo
Rogers R4000 SeriesYesYesNo
Rogers 5000 SeriesYesYesNo
Rogers 6000 SeriesYesYesNo
Rogers TMMYesYesNo

Available Reports
MicrosectionYesYesYes
SolderabilityYesYesYes
X-ray FluorescenceYesYesYes
Ionic ContaminationYesYesYes
Time Domain Reflectometry test (TDR)YesYesYes
FAIYesYesYes
Certificate of Compliance (C of C)YesYesYes

UL
94VOYesYesNo

PCB Classifications

Milspec
MIL-PRF-55110YesNoNo
MIL-PRF-31032/2YesNoNo
MIL-PRF-31032/1YesNoNo
IPC 6012, Class 1, 2 & 3YesYesYes
ISO 9001:2015YesYesYes
ISO 13485:2016YesYesYes
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PCB Capabilities By Market:

High Reliability PC Boards

  • Up to 2000 Thermal cycles
  • For PC Boards that must not fail

Burn-in Boards

  • .5 mm pitch
  • Step-down connectors
  • Special materials
  • High Reliability

High Technology Boards

  • Microelectronics (Line and Space down to .00125"/.00125")
  • Differential Impedance
  • Up to 30 Layers
  • Lead Free process
  • Special materials
  • Sequential lamination
  • Blind and buried vias
  • Laser Drill
  • Filled vias
  • Via in pads
  • Milspec
  • Metal core
  • Carbon paste
  • Plated edges
  • Plated edge holes
  • Milling
  • Heavy Copper
  • Selective Finishes

Standard Technology Boards

  • 1 to 10 Layers
  • Trace/Space 5/5
  • Same day for 2 Layers
  • 24 hours to 10 Days for multilayers
  • Lead Free process
  • All standard materials

PCB Capabilities By Process:

Front-end CAM

  • Fully automated Tooling System

Imaging-Laser Direct Imaging

  • Trace/Space 2/2

Multilayer Lamination

  • Up to 30 Layers
  • Sequential lamination
  • Automated registration

Drilling

  • .006" Mechanical Drill
  • Laser Drill down to 2 mils (.002")

Etching

  • Trace/Space 2/2 mils

Plating

  • Aspect ratio 10+

Soldermask

  • LPI, Dry Film
  • LDI under solder mask

Silkscreen

  • Automated
  • 5 mil lines
  • LPI & Hand silkscreen

Fabrication

  • Route and retain
  • Scoring

Electrical Test

  • .5mm pitch, Flying probe and High Density grid

Materials

  • Lead Free FR-4
  • Polyimides
  • Rogers 4003 & 4350
  • Teflons
  • Ceramics
  • Most other materials
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