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FLEX & RIGID-FLEX PCBs
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QUICKTURN FLEXIBLE PCB PROTOTYPE AND ASSEMBLY
PCB FAB EXPRESS' FLEXIBLE PCB CAPABILITIES
| CAPABILITIES | FLEX | RIGID-FLEX |
|---|---|---|
| Max. Layer Count | 12 | ≥ 16 |
| Min. Core Thickness | .001 in. | .002 in. |
| Min. Starting Cu Foil Thickness O.L. | 9 micron | 9 micron |
| Max. Finished Cu Weight I.L. | 2 oz. | 2 oz. |
| Smallest Mech. Drill Diameter | .0079 in. | .0059 in. |
| Smallest Laser Drill Diameter | .003 in. | .003 in. |
| Max. Through Hole Aspect Ratio | 14:1 | 14:1 |
| Max. Blind Via Aspect Ratio | .75:1 | .75:1 |
| Min. Blind Via Finished Hole Size | .004 in. | .004 in. |
| Min. Buried Via Finished | .004 in. | .004 in. |
| Min. Drill-to-Copper Clearance | .010 in. | .080 in. |
| Min. Trace/Space | ≤.0035 in. | ≤.0030 in. |
| Min. Pad Size for Test | .005 in. | .005 in. |
| Process Pad Diameter | D + .014 in. (1-mil annular ring) | D + .014 in. (1 mil annular ring) |
| Stacked Vias | Yes | Yes |
| Min. Wire-Bond Pad Size | ≥.006 in. | ≥.006 in. |
| Controlled Impedance Tolerance | 10% | 10% |
| Solder-Mask Registration | Within .002 in. | Within .002 in. |
| Solder-Mask Feature Tolerance | .001 in. | .001 in. |
| Solder-Mask Min. Dam Size | .004 in. | .002 in. |
| Min. Diameter Rout Cutter | .024 in. | .024 in. |
| Mechanical Routed Part Size Tolerance | .010 in. | .010 in. |
| Laser Hole Location Tolerance | .0005 in. | .0005 in. |
| Laser Routed Part Size Tolerance (achieved with panels <.032 in. thick) | .001 in. | .001 in. |
| Bow and Twist Tolerance | N/A | 7% along rigid area |
| Thickness Tolerance | 10% | 10% |
| Sequential Laminations | 2 | 2 |
| Conductive Filled Vias | Yes | Yes |
| Nonconductive Filled Vias | Yes | Yes |
Surface Finishes
HASL (Vertical or Horizontal)
OSP (Shikoku F2)
OSP (Entek)
ENIG
Immersion Silver
Immersion White Tin
Tin Nickel
Electrolytic Soft Au
Electrolytic Hard Au
Selective Au
Soldermask for Flex
Green LDI LPI (Taiyo PSR 9000 LDI)
Taiyo PSR 9000 LDI & FXT
Legends in All Colors
Standard Flex Materials:
Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm)
Adhesiveless Copper Clad Base Material 1 mil to 5 mils
Flame Retardant Laminate, Base Material, and Coverlay
High Performance Epoxy Laminate and Prepreg
High Performance Polyimide Laminate and Prepreg
UL and RoHS Compliant Material on request
High Tg FR4 (170+ Tg), Polyimide (260+ Tg)
Base Copper:
1/3 oz. - .00047 in. (.012mm)--rarely used
1/2 oz. - .0007 in. (.018mm)
1 oz. - .0014 in. (.036mm)
2 oz. - .0028 in. (.071mm)
Solder Mask:
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm)
with 0.5 to 2 mil Adhesive (.012mm - .051mm)
LPI and LDI Flexible Soldermasks